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Application

mini/Micro LED equipment

The production process of mini/Micro LED is similar to semiconductor wafers. Similar to creating dies from wafers, LED components can be formed on glass plates and laser cutting machines or cutting equipment are used to separate individual mini LED chips. The LED chip is configured on the plate. In this step, the mini LED chip is connected to the plate using a bonding device or wire bonding technology. In this way, the electrical signal is provided to the mini LED chip. Electrodes are formed on the bonding mini LED chip and the electrodes provide an electric current that causes the mini LED chip to glow.
Mini LED inspection equipment is designed to evaluate the quality and performance of mini LEDs and can sort out defective products before bonding. To efficiently inspect a large volume of LEDs, LED inspection equipment must use high speed imaging combined with high-speed data processing and image analysis to inspect a large number of mini LEDs in a short time. The equipment must test for LED brightness, color temperature, uniformity, contrast, pixel defects, backlight efficiency, and other parameters simultaneously. Mini LED inspection equipment must be flexible and scalable to handle a variety of mini LED sizes, shapes and color patterns. In addition, requirements for smaller feature detection and faster inspection continue to grow. To meet these needs, MORITEX has developed large format and high magnification telecentric lenses. When used with large CMOS sensors, the lenses are able to resolve sub micron features. Telecentric lenses have negligible distortion which allows it to inspect the different variations of LED with the same system. MORITEX telecentric lenses are also able to utilize coaxial illumination to provide collimated bright field light with high uniformity to allow the lens to inspect the entire FOV. By taking a requirements first approach to lens design, MORITEX is able to design lenses that are able to accurately capture the detailed features in high pixel density mini LED displays.

Recommended lens

High magnification MML-HR-35/43 series
Large format telecentric MML-SR series
Custome

Recommended lens
Max.IF
  • Model name
  • Mag.
    [x]
  • O/I
    [mm]
  • WD
    [mm]
  • Resolution
    [μm] *1
  • DOF
    [mm] *2
  • NA
  • Effective F#
  • Max.IF
    [mm]
  • TV distortion
    [%]
Large format
  • MML1-HR130VI-35F
  • 1
  • 328.3
  • 130
  • 4.4~14.6
  • 0.518~1.76
  • 0.077~0.023
  • 6.47~22
  • 35
  • ≤0.017
  • MML2-HR110VI-43F
  • 2
  • 387.64
  • 110
  • 2.68~7.46
  • 0.16~0.44
  • 0.125~0.045
  • 7.99~22
  • 43
  • ≤0.017
  • MML5-HR80DVI-43F
  • 5
  • 400
  • 80
  • 1.99~2.94
  • 0.05~0.07
  • 0.17~0.114
  • 14.7~22
  • 43.5
  • ≤0.011
SR-18C(1.1")
  • MML06-SR110VI-18C
  • 0.6
  • 256.5
  • 110
  • 6.21~23.96
  • 1.24~4.89
  • 0.053~0.013
  • 5.6~22
  • 18
  • ≤0.005
  • MML1-SR65VI-18C
  • 1
  • 204.2
  • 65
  • 4.7~14.8
  • 0.56~1.76
  • 0.071~0.023
  • 7~22
  • 18
  • ≤0.003
  • MML2-SR65VI-18C
  • 2
  • 213.3
  • 65
  • 2.7~7.4
  • 0.16~0.44
  • 0.125~0.045
  • 8~22
  • 18
  • ≤0.005
  • MML3-SR65DVI-18C
  • 3
  • 235.7
  • 65
  • 2.11~4.93
  • 0.084~0.196
  • 0.159~0.068
  • 9.43~22
  • 18
  • ≤0.015
  • MML3-SR65VI-18C
  • 3
  • 235.7
  • 65
  • 2.11~4.93
  • 0.084~0.196
  • 0.159~0.068
  • 9.43~22
  • 18
  • ≤0.015
  • MML4-SR65DVI-18C
  • 4
  • 270.6
  • 65
  • 1.99~3.73
  • 0.059~0.11
  • 0.169~0.09
  • 11.83~22
  • 18
  • ≤0.006
  • MML4-SR65VI-18C
  • 4
  • 270.6
  • 65
  • 1.99~3.73
  • 0.059~0.11
  • 0.169~0.09
  • 11.83~22
  • 18
  • ≤0.006
Custom lens

Welcome to contact with our sales in your area for custom service.

Contact us
Contact Information

MORITEX North America, Inc. California office

Add:6862 Santa Teresa Blvd. San Jose, CA 95119 U.S.A.

E-mail:jewl.chen@cognex.com

Tel:+1-408-363-2100

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