Semiconductor Applications

The semiconductor industry heavily utilizes machine vision in order to continuously improve its capabilities and push the industry forward. It inherently demands extremely high performance machine vision systems as chips grow smaller and the precision required during manufacturing increases. In order to meet these demands, vision systems have had to improve by developing higher resolution sensors and optics.
As the industry has advanced, MORITEX has been able to address the continuing need for high quality optics through our decades of experience, our precision manufacturing, and our design capability. Understanding that the industry is constantly evolving, MORITEX is also able to leverage these key strengths to provide custom lenses that are able to target emerging customer needs.

Wafer Surface Inspection Machine

As the features in wafer surface inspection applications have grown smaller, demands for large format, higher resolution sensors have increased, resulting in the need for lenses that can utilize the new sensor size and resolution. Not only does this mean that lens size needs to increase, but also lens resolution needs to increase in order to leverage the smaller pixels on the sensor. By matching the lens resolution, we are able to achieve high contrast images that can show the details and characteristics of the object. Furthermore, Moritex lenses are able to use coaxial illumination to provide uniform collimated light in order to achieve accurate inspection results.

Recommended lens

Large format telecentric lens MML-HR-35/43 series
High magnification telecentric lens SOD series

Wafer testing device

Vision systems in wafer testing equipment require specialized optics to execute high throughput and high speed identification of wafer positions as well as measurement of tiny devices and circuits. Large format lenses in combination with large format sensors are able to capture a wider field of view in order to inspect more material in a single image thus reducing cycle time. Low Fno/high brightness in conjunction with bright coaxial illumination is needed for high speed imaging to increase production efficiency and yield. Finally, the lenses must be robust enough to withstand constant vibration and high-speed motion. Through durable optical materials and coatings, and stable structural design, we can provide customers with long-term stable product performance.

Recommended lens

ML-NIR series
ML-HR Series
Custom

Dicing machine

Scribing machines must accurately cut circuits and components on a variety of different types of wafers. High resolution lenses and coaxial illumination are required to make precise cuts along the patterns on the wafer. Due to the nature of the cutting, lenses must also use materials and coatings that can withstand continuous operation and also be resistant to water, chemicals, and wear. Depending on the wafer type, lenses that are able to transmit different wavelengths of light from visible to SWIR must be utilized to correspond to each material being cut.

Recommended lens

ML-NIR series
SWIR Series
Custome

Bonding machine

Traditional bonding machines require high magnification and high resolution lenses to provide precise alignment of tiny parts and chips to perform accurate bonding. The machines are continuously inspecting, so lenses are designed to endure harsh vibration environments.
In recent years, flip chip bonding has been widely used instead of traditional bonding due to the requirement of high intensity. In flip chip bonding, the chip is directly attached to the board, shortening the bonding length and increasing the signal transmission speed.
3D bonding uses TSV (Through-Silicon Via) to make vertical connecting holes inside the chips to stack and connect multiple chips. This enables high-speed, intense data transmission, and integration of multiple functions. Optics is a critical part of the system as it influences the alignment accuracy of the parts and chips which impacts the accuracy of the latest 3D bonding. Moritex uses unique optical design technology and center adjustment to observe the characteristics of various materials and structures, select the appropriate bonding process, cover multiple wavelength bands and can inspect different materials and parts. By combining laser focus technology,  observing multispectral images of the object, white light interference technology, and confocal technology, we can provide an ideal optical system for various bonding processes.

Recommended lens

Telecentric lens ML-HR series
Large target telecentric lens ML-SR series
Custom

SMT machine

SMT machines must simultaneously align and bond multiple parts and substrates. Lenses must achieve a large field of view with consistent full field optical performance. Due to the field uniformity requirements, Moritex’s coaxial illumination is the ideal lighting solution to provide full field illumination. Coaxial illumination can highlight the features and structure of the surface of the object under test, achieve high contrast, and can clearly observe the concave and small patterns of the object, thereby achieving efficient alignment. As with many wafer processing machines, the lenses are used in continuous environments that demand robust lens design.

Recommended lens

Low magnification telecentric lens ML-HR series
Large target telecentric lens ML-SR series
Custom